PVD-4 is a physical vapor deposition system, dedicated to the evaporation or sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as its simplicity to use and its competitive price.

Deposition techniques include:
• Thermal & EBeam Evaporation
• Magnetron Sputtering
• Hybrid Configuration
• Organic Configuration

Core System Features:
• Stainless Steel – 320 mm diameter cylindrical
• Fast Entry Frontal Door with viewport
• Sample holder for substrates up to 4” in diameter
• Water cooling to avoid excess heating

This combination does not exist.

SKU: PVD-4

Terms and Conditions
Shipping: Standard off-the-shelf stock items will be delivered within 3-5 working days. Non-stock and bespoke products will be advised on an individual basis.

Thickness Homogeneity

(@ working distance of approx. 100 mm)

+/-2%

Thickness Reading Precision

0.1 A

Deposition Rate Reading Precision

0.01 A

Vacuum Base Pressure

10-7 mbar

Pumping-down Time (10-6 mbar)

< 20 mins

Turbo pump

From 300 l/s to 900 l/s vs N2

Easy to use software

The R&D orientated system can be supplied with an easy-to-use automation

software for full control of any deposition process.

Process supervision software with:

Rate deposition
Thickness control
Pressure display
Temperature control
Valve/Shutter management

Fully & Semi Automatic modes

User mode Access Levels

Recipe modes for Thickness Rate & Deposition Time

Safety management through a PLC:

Interlock management for power supplies
Automatic switching of the machine in safe mode
Pressure, actuators and valves management
First level securities management including Operator protection

Hardware :

Integrated PC with windows 10 connected to a PLC

Configuration type

System

PVD-4 E

PVD-4 S

PVD-4 H*

PVD-4 EB

SUBSTRATE HEATING

(up to 600°C or 900°C)

✓

SUBSTRATE TEMPERATURE CONTROL

(40-70) FOR LIFTOFF

✓

SUBSTRATE ROTATION

✓

CATHODES

(Up to 3)

✓

Max :

2 thermal sources

+ 2 cathodes

THERMAL

(Up to 4 )

✓

Max :
2 thermal sources
+ 2 cathodes

E- BEAM

4 crucibles of 4cc 3KW Power

SECONDARY ELECTRON

SUPPRESSION KIT

✓

SAMPLE BIAS

✓

QUARTZ CONTROLLER

✓

2 OR 100 POSITIONS THROTTLE

VALVE

✓

MOTORIZED REGULATION VALVE

✓

*Multi-deposition system: Sputtering, Organic evaporation, Thermal evaporation

THERMAL & EBEAM EVAPORATION

MAGNETRON SPUTTERING

HYBRID CONFIGURATION

ORGANIC CONFIGURATION

Evaporation by joule effect or electron beam
Up to 4 sources (boats, rods, baskets, filament,
crucibles)
Cross contamination shields included

1” or 2” magnetron cathodes
Integrated pneumatic shutters
RF, DC or DC pulsed source power supplies
Up to 3 cathodes in sputter up configuration
Mass flow controller for gas line
Pressure regulation by throttle valve or motorized
regulation valve

Pressure regulation by throttle valve or motorized
regulation valve
Up to 2 evaporation sources & 2 sputtering
cathodes

Combined Organic & Inorganic Evaporation processes
Up to 2 organic & 2 thermal sources

Testimonial: “As a user of an old Edwards Auto 306 system at the end of its life, I wanted to renew this equipment in favour of a modern machine that is easy to use in the context of our multiuser approach. In terms of quality/price, performance, reliability and ease of use, I am fully satisfied with our PVD-4 thermal evaporation system. “ – Loïc Becerra, clean room manager of a Parisian university.

If you require any additional information regarding this product please contact us via the form below or call us on +44 (0) 1424 447726

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PVD-4 Physical Vapor Deposition System

Not Available For Sale