Multi-purpose PVD System with nanoparticle deposition capability at its core.

The NEXUS is an ultra high vacuum PVD system capable of generating both nanoparticles and thin films that is well-suited for both industry and academic research. Serving a wide range of applications including catalysis, photonics, energy storage, sensors, and life sciences. This UHV deposition system can be integrated with analytical tools to provide a fully customized solution for your research needs.

Key Features
• Generate complex materials by combining nanoparticles and thin films
• Hydrocarbon free nanoparticles using NL-UHV
• UHV system with load-lock, bakeout and pumping upgrade option
• Combination turbo/dry backing pumping
• Confocal port geometry for up to 5 sources
• Compatible with third party sources
• Coating of substrates with rotation, heating and biasing options
• Interlocks to protect both personnel and equipment
• Fully automated and recipe driven software

PVD-4 is a physical vapor deposition system, dedicated to the evaporation or sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as its simplicity to use and its competitive price.

Deposition techniques include:
• Thermal & EBeam Evaporation
• Magnetron Sputtering
• Hybrid Configuration
• Organic Configuration

Core System Features:
• Stainless Steel – 320 mm diameter cylindrical
• Fast Entry Frontal Door with viewport
• Sample holder for substrates up to 4” in diameter
• Water cooling to avoid excess heating

The PVD-6 is a physical vapor deposition system, dedicated to the sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as its simplicity to use and its competitive price.

Core System Features:
• Stainless Steel – 500 mm diameter cylindrical
• Fast Entry Frontal Door with viewport
• Sample holder for substrates up to 6” in diameter
• Water cooling to avoid excess heating

The PVD20-EB is a physical vapor deposition system, dedicated to the electron beam deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as its simplicity to use and its competitive price.

Core System Features:
• D-shape steel – 500 mm diameter cylindrical chamber
• Full access frontal door with 2 viewports for easy maintenance
• Sample holder for substrates up to 6” in diameter
• Rotating and water cooled substrate holder
• Water cooling to avoid excess heating
• Secured cryo pumping group

E-Beam Evaporation:
• 8X8 cc or 6X7 cc electron beam source (Ti, Au, Ag, Al, Cr, W, Pt)
• Power supply from 3 kW to 12 kW
• Gas panel for Ar, O2, N2
• Accurate control of deposition rates
• Loadlock (option)
• RF plasma pre-cleaning (option)

The PVD20-S is a physical vapor deposition system, dedicated to the sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as is its simplicity to use and its competitive price.

Core System Features:
• D-shape steel – 500 mm diameter cylindrical
• Full access frontal door with 2 viewports for easy maintenance
• Sample holder for substrates up to 6” in diameter
• Rotating and heating (up to 350°C) substrate holder
• Water cooling to avoid excess heating
• Secured cryo pumping group (option)
• Loadlock (option)
• RF plasma pre-cleaning (option)

Sputtering Process:
• Up to 4 x 3-inch cathode magnetrons in Sputter Up configuration
• RF / DC power supply
• Process pressure: 10-3 – 10-1 mbar with a motorized throttle valve
• Up to 8 cathodes in sputter up configuration
• Gas panel for Ar, O2, N2
• Accurate control of deposition rates (crystal sensor)

The PVD20-TE is a physical vapor deposition system, dedicated to the joule heating deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as is its simplicity to use and its competitive price.

Core System Features:
• D-shape steel – 500 mm diameter cylindrical
• Full access frontal door with 2 viewports for easy maintenance
• Sample holder for substrates up to 6” in diameter
• Rotating and heating (up to 350°C) substrate holder
• Water cooling to avoid excess heating
• Secured cryo pumping group (option)
• Loadlock (option)
• RF plasma pre-cleaning (option)

Thermal Evaporation Process:
• Evaporation by joule effect
• Up to 4 sources (boats, rods, baskets, filament, crucibles)
• Cross contamination shields included
• DC power supply with temperature regulation
• End Hall Effect pre clean/deposition assist
• Gas panel for Ar, O2, N2
• Accurate control of deposition rates (crystal sensor)