PVD Systems
Physical vapor deposition (PVD) refers to a variety of vacuum deposition methods. Physical processes such as sputtering and evaporation (organic or inorganic) are used in PVD to generate a vapor, in the form of atoms, molecules, or ions. This vapor is carried across a region of low pressure from source to substrate. Upon contact with the substrate the vapor condenses to form a thin film layer. Films can be grown in this way as coatings, multilayer stacks, composites etc. to grow fully structured devices.
PVD Product Categories
PVD-4
PVD-6
PVD-8
PVD-4+
PVD20
System Comparison Table
| PVD4 | PVD4+ | PVD6 | PVD8 | PVD20 | |
|---|---|---|---|---|---|
| Process Technology | Magnetron Sputtering (SU)
Thermal Evaporation Hybrid Organic Evaporation |
Magnetron Sputtering (SU) up to 4 x 2’’ or 3 x 3” cathodes Hybrid Sputtering & Thermal Evaporation Hybrid E-beam & Thermal Evaporation |
Magnetron Sputtering – Sputter Up or Sputter down configurations – Standard: Up to 6 x 2’’ cathodes in confocal array – Special: mix of 2’’ & 3”, or 4” in confocal, planar or off-axis |
Magnetron Sputtering – Sputter Up or Sputter down configurations – Standard: Up to 8 x 2’’ cathodes in confocal array (standard) – Special: mix of 2’’ & 3”, or 4” in confocal, planar or off-axis |
Magnetron Sputtering (SU) – up to 4 x 3’’ or 3 x 4” cathodes Hybrid Sputtering & Thermal Evaporation Hybrid E-beam & Thermal Evaporation |
| Vacuum level | Standard 5 E-7 mbar
Enhanced Performance 5E-8 mbar |
Standard 5 E-8 mbar
Enhanced Performance 8E-10 mbar |
Standard 5 E-7 mbar
Enhanced Performance 5E-8 mbar |
Enhanced Performance 8E-10 mbar
Standard 5 E-8 mbar |
Standard 5 E-7 mbar
Enhanced Performance 5E-8 mbar |
| Chamber type | Cylindrical SS304L | Cylindrical SS304L | Cylindrical SS304L | Cylindrical SS304L | D-Chamber SS304L |
| Load Lock compatibility | No | Yes – one sample at a time | Yes Standard: one sample at a time Enhanced Performance : up to 6 samples with motorized lift. |
Yes Standard: one sample at a time Enhanced Performance : up to 6 samples with motorized lift |
Yes Standard: one sample at a time Enhanced Performance : up to 6 samples with motorized lift |
| Substrate size | Up to 6 circular Or 4’’ x 4’’ square Compatible small pieces & shapes Compatible with masks |
Up to 6 circular Or 4’’ x 4’’ square Compatible small pieces & shapes Compatible with masks |
Up to 6 circular Or 4’’ x 4’’ square Compatible small pieces & shapes Compatible with masks |
Up to 6 circular Or 4’’ x 4’’ square Compatible small pieces & shapes Compatible with masks |
Up to 6 circular Or 4’’ x 4’’ square Compatible small pieces & shapes Compatible with masks |
| Sample Treatment | Heating Standard 350 °C on sample with stabilized T-regulation design Enhanced Performance 850 °C on sample Direct Cooling on sample according to Process chilled water capacity (e.g. -20°C with special chillers) |
Heating Standard 350 °C on sample with stabilized T-regulation design Enhanced Performance 850 °C on sample Direct Cooling on sample according to Process chilled water capacity (e.g. -20°C with special chillers) |
Heating Standard 350 °C on sample with stabilized T-regulation design Enhanced Performance 850 °C on sample Direct Cooling on sample according to Process chilled water capacity (e.g. -20°C with special chillers) |
Heating Standard 350 °C on sample with stabilized T-regulation design Enhanced Performance 850 °C on sample Direct Cooling on sample according to Process chilled water capacity (e.g. -20°C with special chillers) |
Heating Standard 350 °C on sample with stabilized T-regulation design Enhanced Performance 850 °C on sample Direct Cooling on sample according to Process chilled water capacity (e.g. -20°C with special chillers) |
| Sample Rotation | Up to 30 RPM according to compatibility with other options |
Up to 30 RPM according to compatibility with other options |
Up to 30 RPM according to compatibility with other options |
Up to 30 RPM according to compatibility with other options |
Up to 30 RPM according to compatibility with other options |
| Sample to source variation | Fixed or Variable according to compatibility with other options |
Fixed or Variable according to compatibility with other options |
Fixed or Variable according to compatibility with other options |
Fixed or Variable according to compatibility with other options |
Fixed or Variable according to compatibility with other options |
| Process Feedback | Quartz crystal sensor for growth rate Standard: Sequential layer by layer growth feedback Enhanced Performance: Co-deposition for compound or stack growth |
Quartz crystal sensor for growth rate Standard: Sequential layer by layer growth feedback Enhanced Performance: Co-deposition for compound or stack growth |
Quartz crystal sensor for growth rate Standard: Sequential layer by layer growth feedback Enhanced Performance: Co-deposition for compound or stack growth |
Quartz crystal sensor for growth rate Standard: Sequential layer by layer growth feedback Enhanced Performance-1: Co-deposition for compound or stack growth Enhanced Performance-2: High Pressure RHEED for insitu study of morphology and roughness |
Quartz crystal sensor for growth rate Standard: Sequential layer by layer growth feedback Enhanced Performance: Co-deposition for compound or stack growth |
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