PVD4+
PVD4 is a physical vapor deposition system, dedicated to the Evaporation or Sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as its simplicity to use and its competitive price.
Turbo pump
nEXT400D
ISO160
Dry Scroll
pump nXDS10i
WRG Wide
Range Gauge
(Pirani + Penning)
measures
from Patm to
10-9 mbar
APG100 Active
Pirani gauge
measures
from Patm to
10-3 mbar
Core System features
- Stainless steel – 400 mm diameter cylindrical
- Fast Entry Frontal Door with viewport
- Sample holder for substrates up to 6” in diameter
- Water cooling to avoid excess heating
- Compatible with Load Lock integration
- Compatible with clean room integration
Specifications
Thickness Homogeneity (@ working distance of approx. 100 mm) |
+/-3% |
Thickness Reading Precision | 0.1 A |
Deposition Rate Reading Precision | 0.01 A |
Vacuum Base Pressure | 10-7 mbar or 10-8 mbar |
Pumping-down Time (10-6 mbar) | < 20 mins |
Turbo pump | From 300 l/s to 900 l/s vs N2 |
Deposition Techniques
THERMAL & EBEAM EVAPORATION
- Evaporation by joule effect and/or electron beam
- Up to 4 joule sources (boats, rods, baskets, filament,
crucibles) - Multi-pocket E-beam source
- Cross contamination shields included
MAGNETRON SPUTTERING
- 2” or 3” magnetron cathodes
- Integrated pneumatic shutters
- RF, DC or DC pulsed source power supplies
- Up to 4×2″ or 3 x 3″ cathodes in sputter up configuration
- Mass flow controller for gas line
- Pressure regulation by throttle valve or motorized
regulation valve
HYBRID CONFIGURATION
- Combined Sputtering & Evaporation processes
- Up to 4 evaporation sources & 2 x 2’’ sputtering
cathodes
Easy to Use Software
The R&D orientated system can be supplied with an easy-to-use automation
software for full control of any deposition process.
Process supervision software with:
- Rate deposition
- Thickness control
- Pressure display
- Temperature control
- Valve/Shutter management
Fully & Semi Automatic modes
User mode Access Levels
Recipe modes for Thickness Rate & Deposition Time
Safety management through a PLC:
- Interlock management for power supplies
- Automatic switching of the machine in safe mode
- Pressure, actuators and valves management
- First level securities management including Operator protection
Hardware :
Integrated PC with windows 10 connected to a PLC
Get In Touch Today
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