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PVD-4

UHV Systems > Thin Film Deposition Systems > PVD Systems > PVD-4

PVD-4 is a physical vapor deposition system, dedicated to the Evaporation or Sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as its simplicity to use and its competitive price.

Testimonial: “User of an old Edwards Auto 306 system at the end of its life, I wanted to renew this equipment in favour of a modern machine that is easy to use in the context of our multiuser approach. In terms of quality/price, performance, reliability and ease of use, I am fully satisfied with our PVD-4 thermal evaporation system. “ – Loïc Becerra, clean room manager of a Parisian university

Turbo pump
nEXT300D
ISO100

Dry Scroll
pump nXDS6i

WRG Wide
Range Gauge
(Pirani + Penning)
measures
from Patm to
10-9 mbar

APG100 Active
Pirani gauge
measures
from Patm to
10-3 mbar

Core System features

  • Stainless steel – 320 mm diameter cylindrical
  • Fast Entry Frontal Door with viewport
  • Sample holder for substrates up to 4” in diameter
  • Water cooling to avoid excess heating

Specifications

Thickness Homogeneity
(@ working distance of approx. 100 mm)		 +/-2%
Thickness Reading Precision  0.1 A
Deposition Rate Reading Precision 0.01 A
Vacuum Base Pressure 10-7 mbar
Pumping-down Time (10-6 mbar) < 20 mins
Turbo pump From 300 l/s to 900 l/s vs N2

Deposition Techniques

THERMAL & EBEAM EVAPORATION

  • Evaporation by joule effect or electron beam
  • Up to 4 sources (boats, rods, baskets, filament,
    crucibles)
  • Cross contamination shields included

MAGNETRON SPUTTERING

  • 1” or 2” magnetron cathodes
  • Integrated pneumatic shutters
  • RF, DC or DC pulsed source power supplies
  • Up to 3 cathodes in sputter up configuration
  • Mass flow controller for gas line
  • Pressure regulation by throttle valve or motorized
    regulation valve

HYBRID CONFIGURATION

  • Pressure regulation by throttle valve or motorized
    regulation valve
  • Up to 2 evaporation sources & 2 sputtering
    cathodes

ORGANIC CONFIGURATION

  • Combined Organic & Inorganic Evaporation processes
  • Up to 2 organic & 2 thermal sources

Easy to Use Software

The R&D orientated system can be supplied with an easy-to-use automation
software for full control of any deposition process.
Process supervision software with:

  • Rate deposition
  • Thickness control
  • Pressure display
  • Temperature control
  • Valve/Shutter management

Fully & Semi Automatic modes
User mode Access Levels
Recipe modes for Thickness Rate & Deposition Time
Safety management through a PLC:

  • Interlock management for power supplies
  • Automatic switching of the machine in safe mode
  • Pressure, actuators and valves management
  • First level securities management including Operator protection

Hardware :
Integrated PC with windows 10 connected to a PLC

Compatibility Matrix

Configuration type System
PVD-4 E PVD-4 S PVD-4 H* PVD-4 EB
SUBSTRATE HEATING
(up to 600°C or 900°C)		 ✓ ✓ ✓ ✓
SUBSTRATE TEMPERATURE CONTROL
(40-70) FOR LIFTOFF		 ✓ ✓ ✓ ✓
SUBSTRATE ROTATION ✓ ✓ ✓ ✓
CATHODES
(Up to 3)		 – ✓ Max :
2 thermal sources
+ 2 cathodes		 –
THERMAL
(Up to 4 )		 ✓ – Max :
2 thermal sources
+ 2 cathodes		 –
E- BEAM – – –
SECONDARY ELECTRON
SUPPRESSION KIT		 – – -✓
SAMPLE BIAS – ✓ ✓ ✓
QUARTZ CONTROLLER ✓ ✓ ✓ ✓
2 OR 100 POSITIONS THROTTLE
VALVE		 – ✓ ✓ –
MOTORIZED REGULATION VALVE – ✓ ✓ –

Get In Touch Today

Get in touch today to discuss your requirements, please contact us on

+44 (0) 1424 447726   

[email protected]