PVD-20
PVD20-S
PVD20-TE
PVD20-EB
PVD20-S

Specifications
Thickness Homogeneity (@ working distance of approx. 500 mm) |
+/-5% |
Thickness Reading Precision | 0.1 A |
Deposition Rate Reading Precision | 0.01 A |
Vacuum Base Pressure | 10-7 mbar |
Pump group | TMP (cryo for 10-8 mbar range) |

Core System features
- D-shape steel – 500 mm diameter cylindrical
- Full access frontal Door with 2 viewports for easy
maintenance - Sample holder for substrates up to 6” in diameter
- Rotating and heating (up to 350°C) substrate holder
- Water cooling to avoid excess heating
- Secured cryo pumping group (option)
- Loadlock (option)
- RF plasma pre-cleaning (option)

Sputtering Process
- Up to 4 x 3-inch cathode magnetrons in Sputter Up configuration
- RF / DC power supply
- Process pressure : 10-3 – 10-1 mbar with a motorized throttle valve
- Up to 8 cathodes in sputter up configuration
- Gas panel for Ar, O2, N2
- Accurate control of deposition rates (crystal sensor)
Easy to Use Software
The R&D orientated system can be supplied with an easy to use automation software for full control of any deposition process.
Process supervision software with:
- Vacuum Display
- Process Pressure display
- Pressure display
- Temperature control
- Valve/Shutter management
Fully & Semi Automatic modes
Recipe modes with traceability
User mode Access Levels
Safety management through a PLC:
- Interlock management for power supplies
- Automatic switching of the machine in safe mode
- Pressure, actuators and valves management
- First level securities management
Hardware :
Integrated PC with windows 7 connected to a PLC

Compatibility Matrix
Configuration type | |
---|---|
PVD20-S | |
SUBSTRATE HEATING (up to 400°C or 900°C) |
✓ |
SUBSTRATE ROTATION | ✓ |
PULLEY FOR QUICK CHANGE OF DEPOSITION STAGE | ✓ |
CATHODES 3″ |
Up to 4 |
RF POWER SUPPLY | ✓ |
DC POWER SUPPLY | ✓ |
LOAD LOCK | ✓ |
RF PRE-CLEANING | ✓ |
QUARTZ CONTROLLER | ✓ |
PVD20-TE

Specifications
Thickness Homogeneity (@ working distance of approx. 500 mm) |
Better than +/-5% |
Thickness Reading Precision | 0.1 A |
Deposition Rate Reading Precision | 0.01 A |
Vacuum Base Pressure | 10-7 mbar |
Pump group | TMP (cryo for 10-8 mbar range) |

Core System features
- D-shape steel – 500 mm diameter cylindrical
- Full access frontal Door with 2 viewports for easy
maintenance - Sample holder for substrates up to 6” in diameter
- Rotating and heating (up to 350°C) substrate holder
- Water cooling to avoid excess heating
- Secured cryo pumping group (option)
- Loadlock (option)
- RF plasma pre-cleaning (option)

Thermal Evaporation Process
- Evaporation by joule effect
- Up to 4 sources (boats, rods, baskets, filament, crucibles)
- Cross contamination shields included
- DC power supply with temperature regulation
- End Hall Effect pre clean/deposition assist
- Gas panel for Ar, O2, N2
- Accurate control of deposition rates (crystal sensor)
Easy to Use Software
The R&D orientated system can be supplied with an easy to use automation software for full control of any deposition process.
Process supervision software with:
- Vacuum Display
- Process Pressure display
- Pressure display
- Temperature control
- Valve/Shutter management
Fully & Semi Automatic modes
Recipe modes with traceability
User mode Access Levels
Safety management through a PLC:
- Interlock management for power supplies
- Automatic switching of the machine in safe mode
- Pressure, actuators and valves management
- First level securities management
Hardware :
Integrated PC with windows 7 connected to a PLC

Compatibility Matrix
Configuration type | |
---|---|
PVD20-TE | |
SUBSTRATE HEATING (up to 400°C or 900°C) |
X |
SUBSTRATE ROTATION | X |
PULLEY FOR QUICK CHANGE OF DEPOSITION STAGE | X |
JOULE HEATERS | Up to 4 |
RF POWER SUPPLY | X |
DC POWER SUPPLY | X |
LOAD LOCK | X |
RF PRE-CLEANING OR DC ION BEAM | X |
QUARTZ CONTROLLER | X |
PVD20-EB

Specifications
Thickness Homogeneity (@ working distance of approx. 506 mm) |
< +/-5% |
Thickness Reading Precision | 0.1 A |
Deposition Rate Reading Precision | 0.01 A |
Vacuum Base Pressure | 10-8 mbar |
Pumping group | Cryogenic |

Core System features
- D-shape steel – 500 mm diameter cylindrical
- Full access frontal Door with 2 viewports for easy
maintenance - Sample holder for substrates up to 6” in diameter
- Rotating and water cooled substrate holder
- Water cooling to avoid excess heating
- Secured cryo pumping group

E-Beam Evaporation
- 8X8 cc or 6X7 cc electron beam source (Ti, Au, Ag, Al, Cr, W, Pt)
- Power supply from 3 kW to 12 kW
- Gas panel for Ar, O2, N2
- Accurate control of deposition rates
- Loadlock (option)
- RF plasma pre-cleaning (option)
Easy to Use Software
The R&D orientated system can be supplied with an easy to use automation software for full control of any deposition process.
Process supervision software with:
- Vacuum Display
- Process Pressure display
- Pressure display
- Temperature control
- Valve/Shutter management
Fully & Semi Automatic modes
Recipe modes with traceability
User mode Access Levels
Safety management through a PLC:
- Interlock management for power supplies
- Automatic switching of the machine in safe mode
- Pressure, actuators and valves management
- First level securities management
Hardware :
Integrated PC with windows 7 connected to a PLC

Compatibility Matrix
Configuration type | |
---|---|
PVD20-EB | |
SUBSTRATE COOLING (down to 150°C) |
X |
SUBSTRATE ROTATION | X |
PULLEY FOR QUICK CHANGE OF DEPOSITION STAGE | X |
CRUCIBLES | Up to 8 |
CAPACITY/CRUCIBLE | Up to 15 cc |
LOAD LOCK | X |
RF PRE-CLEANING | X |
QUARTZ CONTROLLER | X |
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