PVD-6

The PVD-6 is a physical vapor deposition system, dedicated to the Sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of every day applications, as its simplicity to use and its competitive price.

Specifications

Thickness Homogeneity
(@ working distance of approx. 100 mm)
+/-3%
Thickness Reading Precision  0.1 A
Deposition Rate Reading Precision 0.01 A
Vacuum Base Pressure 10-7 mbar or 10-8
mbar if LL
Pumping-down Time (10-6 mbar) < 20 mins
Turbo pump 550 L/s on N2

Core System features

  • Stainless steel – 500 mm diameter cylindrical
  • Fast Entry Frontal Door with viewport
  • Sample holder for substrates up to 6” in diameter
  • Water cooling to avoid excess heating

Magnetron Suttering

  • 3” magnetron cathodes
  • Integrated pneumatic shutters
  • RF, DC or DC pulsed source power supplies
  • Up to 6 cathodes in sputter up configuration
  • Mass flow controller for gas line
  • Pressure regulation by throttle valve

Easy to Use Software

The R&D orientated system can be supplied with an easy to use automation
software for full control of any deposition process.
Process supervision software with:

  • Vacuum Display
  • Process Pressure display
  • Pressure display
  • Temperature control
  • Valve/Shutter management

Fully & Semi Automatic modes
Recipe modes with traceability
User mode Access Levels
Safety management through a PLC:

  • Interlock management for power supplies
  • Automatic switching of the machine in safe mode
  • Pressure, actuators and valves management
  • First level securities management

Hardware :
Integrated PC with windows 7 connected to a PLC

Compatibility Matrix

Configuration type
PVD-6
SUBSTRATE HEATING
(up to 350°C or 900°C)
X
SUBSTRATE ACTIVE COOLING
OR TEMPERATURE CONTROL
X
SUBSTRATE ROTATION X
CATHODES
3″
Up to 6
LOAD LOCK X
SAMPLE BIAS X
QUARTZ CONTROLLER X
THROTTLE VALVE X

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