PVD-8

The PVD-8 is a physical vapor deposition system, dedicated to the Sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of every day applications, as its simplicity to use and its competitive price.

Specifications

Thickness Homogeneity
(@ working distance of approx. 100 mm)
+/-2%
Thickness Reading Precision  0.1 A
Deposition Rate Reading Precision 0.01 A
Vacuum Base Pressure 8 x 10-8 mbar
Pumping-down Time (10-6 mbar) < 20 mins
Turbo pump 700 L/s on N2

Core System features

  • Stainless steel – 320 mm diameter cylindrical
  • Sample holder for substrates up to 2” in diameter
  • Water cooling to avoid excess heating

Magnetron Sputtering

  • 2” magnetron cathodes
  • Integrated pneumatic shutters
  • RF, DC or DC pulsed source power supplies
  • Up to 8 cathodes in sputter up configuration
  • Mass flow controller for gas line
  • Pressure adjustment by motorized throttle valve

Easy to Use Software

The R&D orientated system can be supplied with an easy to use automation software for full control of any deposition process.

Process supervision software with:

  • Vacuum Display
  • Process Pressure display
  • Pressure display
  • Temperature control
  • Valve/Shutter management

Fully & Semi Automatic modes

Recipe modes with traceability

User mode Access Levels

Safety management through a PLC:

  • Interlock management for power supplies
  • Automatic switching of the machine in safe mode
  • Pressure, actuators and valves management
  • First level securities management

Hardware :
Integrated PC with windows 7 connected to a PLC

Compatibility Matrix

Configuration type
PVD-6
SUBSTRATE HEATING
(up to 600°C or 900°C)
X
SUBSTRATE ACTIVE COOLING
(down to -150°)
X
SUBSTRATE ROTATION X
CATHODES
2″
Up to 8
LOAD LOCK X
SAMPLE BIAS X
QUARTZ CONTROLLER X
THROTTLE VALVE X

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