PECVD Series
UHV Systems > Thin Film Deposition Systems > PECVD
PECVD
Small Scale Production
This system is used to deposit layers under high vacuum conditions on samples that are RF biased . It is a low temperature technique when compared to typical CVD process, which is a major advantage.
Core System Features
- Base Pressure 1. 10 -6 mbar
- Samples up to 300 mm
- Inferior plate of 500 mm diameter with RF bias
- Various Process gases (TMS, Hexane, CF4, O 2, Ar)
- Pumping group (Suitable for corrosive gases)
- Automated Control
Powerful Software
- Fully & Semi Automatic modes
- User mode Access Levels
Recipe modes for
- Thickness Rate & Deposition Time
- Pre-programmed recipe library
Hardware
Integrated PC with Microsoft Windows
Process Acquisition software with:
- Rate deposition
- Thickness control
- Pressure Display
- Temperature Control
- Valve/Shutter management
Materials
- DLC
- Doped/Undoped AmorphousSi
- Dielectrics (Nitrides, Oxynitrides..)
Applications
- Barrier Films
- Insulators
- Optical coatings
- Biomedical
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